SOOSAI, T. .; MHD NOOR, E. E.; BAIG, M. F. .; AKSO, C. . Effects of Composition and Processing on the Properties of Sn-3Zn-4Bi and Sn-Ag-Cu Solder Alloys for Electronic Packaging. International Journal on Robotics, Automation and Sciences, [S. l.], v. 7, n. 3, p. 1–7, 2025. DOI: 10.33093/ijoras.2025.7.3.1. Disponível em: https://mmupress.com/index.php/ijoras/article/view/2403. Acesso em: 1 dec. 2025.