T. . Soosai, E. E. Mhd Noor, M. F. . Baig, and C. . Akso, “Effects of Composition and Processing on the Properties of Sn-3Zn-4Bi and Sn-Ag-Cu Solder Alloys for Electronic Packaging”, IJORAS, vol. 7, no. 3, pp. 1–7, Nov. 2025.