CHOO KAN YEEP; LIM E LIN; ONG DUU SHENG; YOU AH HENG. Effects of Anode Design and Configuration on the Growth Dynamics and Surface Morphologies of Electrodeposited Copper Films. Journal of Engineering Technology and Applied Physics, [S. l.], v. 3, n. 1, p. 22–29, 2021. DOI: 10.33093/jetap.2021.3.1.5. Disponível em: https://mmupress.com/index.php/jetap/article/view/157. Acesso em: 25 apr. 2025.