LOH, S. H.; TEH, P. C.; SIM, J. J.; YEAP, K. H.; LEE, Y. K. Integrated Circuit Packaging Recognition with Tilt Auto Adjustment using Deep Learning Approach. Journal of Engineering Technology and Applied Physics, [S. l.], v. 5, n. 2, p. 79–84, 2023. DOI: 10.33093/jetap.2023.5.2.9. Disponível em: https://mmupress.com/index.php/jetap/article/view/568. Acesso em: 25 apr. 2025.