Loh, Siu Hong, Peh Chiong Teh, Jia Jia Sim, Kim Ho Yeap, and Yong Kang Lee. 2023. “Integrated Circuit Packaging Recognition With Tilt Auto Adjustment Using Deep Learning Approach”. Journal of Engineering Technology and Applied Physics 5 (2):79-84. https://doi.org/10.33093/jetap.2023.5.2.9.